The Croatian manager coached Eintracht Frankfurt last season, winning the German Cup, but this season he has had many troubles with the Bundesliga giantsIf somebody knows current Bayern Munich manager Niko Kovac is Eintracht Frankfurt president Peter Fischer.After all, Kovac spent two years with Frankfurt, lifting the German Cup trophy, the first title for his team since 1988.But now, the Croatian is having a hard time coaching FC Bayern Munich.“Niko is an incredibly possessed, fair, diligent person,” Fischer was quoted by Bavarian Football Works.Merson believes Arsenal should sign Sancho Manuel R. Medina – September 14, 2019 Borussia Dortmund winger Jadon Sancho might be the perfect player to play for the Gunners, according to former England international Paul Merson.“That comes to a great extent from his faith. Faith balances him. He’s thus also not an unfair person; he can’t put up with injustices hardly at all.”“Niko is a coach people follow and can trust. With him, yes means yes and no means no. That’s not true of every coach,” he added.“At Frankfurt, Kovac was where scarcely a single player had won anything. Munich, in contrast, is full of everything-winners.”“Bayern’s players have high self-confidence and a high self-understanding and had to adjust to a new coach who did a ton of things differently,” he concluded.
WILMINGTON, MA — Rudolph Technologies, Inc. recently announced that it has received orders for over $15 million of legacy and new process control systems from a memory manufacturer based in Asia. The systems will be used by a top-tier memory chip maker as they rapidly transition high-end DRAM (DDR4, DDR5) and HBM DRAM packaging from wire bonding to advanced packaging architectures. The shift from wire bonding is needed to achieve higher data speeds, superior power distribution and thermal properties using copper pillars, micro-bumps, and through silicon vias (TSVs) for stacked chip-to-chip interconnects.Delivery of systems will be completed by the end of the first quarter, with additional orders expected throughout 2019 as memory manufacturers transition their high-speed DRAM from wire-bonded architecture to advanced packaging.“Rudolph began working with our customers’ R&D teams nearly ten years ago to develop 2D/3D measurements of the emerging copper bump process. That long-term customer engagement has resulted in systems and software that we believe to be the industry standard for advanced packaging metrology,” stated Cleon Chan, vice president of global field operations at Rudolph. “Stacking die using TSVs and micro-bumps for HBM DRAM packages requires precise control of the copper features that will ultimately make the electrical connections between the stacked memory chips and the logic chip in the same package. After significant development in the package and the process control methods, these devices are now beginning high-volume manufacturing, which is being driven by the data speed and capacity demands from big data servers and graphics applications. These new, non-wire bonded memory architectures are creating a very healthy demand for our back-end process control systems. This customer is also using Rudolph systems for post-saw film-frame inspection looking for package defects.”A combination of Rudolph’s 2D/3D inspection systems and metal metrology systems provide a total process control solution to help assure that height, diameter, location and coplanarity of copper micro-bumps, pillar bumps, and TSVs are precisely controlled. After the packages are molded and separated by sawing, additional Rudolph inspection systems provide outgoing quality checks for sidewall delamination and/or hairline cracks, which are considered killer defects for advanced memory packages.About Rudolph TechnologiesRudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, lithography, process control metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide. Rudolph delivers comprehensive solutions throughout the fab with its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market of their devices. Headquartered in Wilmington, Massachusetts, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at http://www.rudolphtech.com.(NOTE: The above press release is from Rudolph Technologies via BusinessWire.)Like Wilmington Apple on Facebook. Follow Wilmington Apple on Twitter. Follow Wilmington Apple on Instagram. Subscribe to Wilmington Apple’s daily email newsletter HERE. Got a comment, question, photo, press release, or news tip? Email firstname.lastname@example.org.Share this:TwitterFacebookLike this:Like Loading… RelatedWilmington’s Rudolph Technologies Receives $8M Order From Leading Asian Memory ManufacturerIn “Business”Wilmington’s Rudolph Technologies Unveils New Inspection Suite For Semiconductor ManufacturingIn “Business”Wilmington’s Rudolph Technologies Receives $11 Million OrderIn “Business” read more
There have been reports that there are warring factions within the Indian team. Robert Cianflone/Getty ImagesThe Committee of Administrators (CoA) is reportedly not going to discuss the alleged rift in the Indian team at its meeting on Friday as they feel it’s the Indian players who need to bring up the issue, IANS reported. A CoA member while speaking to the news agency stated that they are probably not going to bring up the issue of rifts in the team unless the players mention it themselves, as they cannot act on the basis of media reports only.”The CoA cannot be reacting to reports in the media. If the players have any issue, they can/should bring it up with us. As far as the committee is concerned, there is no rift till the players talk of it with us,” the member told IANS.On the other hand, a senior BCCI official said to the same agency that the CoA needs to address the rifts within the team or ask the manager to submit a report as this rift needs to be resolved. He also asserted that the stories of the rifts need to be laid to rest by taking up the matter seriously. Getty Images”I wish the CoA would really focus on what they are required to focus on — administration. Someone in the CoA seems so hell-bent on getting involved in board politics that the real job has been left undone. We are appalled by the news of rifts in the team coming out daily and at the absence of any effort to either lay the stories to rest or to solve the issue if it really exists. Surely, the manager can be asked to submit a report since it is an administrative issue,” the board official said.After India’s World Cup exit in the semi-final against New Zealand, there have been reports doing the rounds regarding rifts within the team. There were reports that the Indian team has been divided into two groups, one supporting Rohit Sharma and another having their allegiance to Virat Kohli. Virat Kohli and Rohit Sharma.IANSThere was another controversy regarding senior members of the team not being happy with one cricketer for not abiding by the family clause. Many players are also unhappy with the coaching staff. All these controversies need to be resolved soon so that the performance of the team does not get affected. The Men in Blue are going to play three ODIs, two T20 internationals and two Test matches in August during their tour to West Indies. read more