Bid now on two tickets to the premiere and after-party of A Million Ways to Die in the West in LA on May 15 and meet the star, Charlize Theron, for a quick photograph.Seth MacFarlane directs, produces, co-writes and plays the role of the cowardly sheep farmer Albert in A Million Ways to Die in the West. After Albert backs out of a gunfight, his fickle girlfriend leaves him for another man. When a mysterious and beautiful woman rides into town, she helps him find his courage and they begin to fall in love. But when her husband, a notorious outlaw, arrives seeking revenge, the farmer must put his newfound courage to the test.Starring alongside MacFarlane are Oscar winner Charlize Theron, Liam Neeson, Amanda Seyfried, Giovanni Ribisi, Sarah Silverman and Neil Patrick Harris. MacFarlane reunites many of the filmmakers behind Universal and MRC’s hit film Ted including Scott Stuber (Bluegrass Films) and Jason Clark who produce, and Wellesley Wild and Alec Sulkin who co-wrote the script.This auction benefits the Charlize Theron Africa Outreach Project, an organization created in 2007 by Charlize Theron, Academy Award winning actor and UN Messenger of Peace, in an effort to support African youth in the fight against HIV/AIDS. Although the geographic scope of CTAOP is Sub-Saharan Africa, the primary area of focus has been Charlize’s home country of South Africa.The auction is open until May 7, and can be accessed via CharityBuzz.
APTN National NewsA United Nations report gave Canada an earful about how its citizens feed themselves.Olivier de Schutter has spent the past two weeks travelling Canada and looking into how Canadians eat.APTN National News reporter Annette Francis tells us there is a lot of work to do.
WILMINGTON, MA — Rudolph Technologies, Inc. recently announced that it has received orders for over $15 million of legacy and new process control systems from a memory manufacturer based in Asia. The systems will be used by a top-tier memory chip maker as they rapidly transition high-end DRAM (DDR4, DDR5) and HBM DRAM packaging from wire bonding to advanced packaging architectures. The shift from wire bonding is needed to achieve higher data speeds, superior power distribution and thermal properties using copper pillars, micro-bumps, and through silicon vias (TSVs) for stacked chip-to-chip interconnects.Delivery of systems will be completed by the end of the first quarter, with additional orders expected throughout 2019 as memory manufacturers transition their high-speed DRAM from wire-bonded architecture to advanced packaging.“Rudolph began working with our customers’ R&D teams nearly ten years ago to develop 2D/3D measurements of the emerging copper bump process. That long-term customer engagement has resulted in systems and software that we believe to be the industry standard for advanced packaging metrology,” stated Cleon Chan, vice president of global field operations at Rudolph. “Stacking die using TSVs and micro-bumps for HBM DRAM packages requires precise control of the copper features that will ultimately make the electrical connections between the stacked memory chips and the logic chip in the same package. After significant development in the package and the process control methods, these devices are now beginning high-volume manufacturing, which is being driven by the data speed and capacity demands from big data servers and graphics applications. These new, non-wire bonded memory architectures are creating a very healthy demand for our back-end process control systems. This customer is also using Rudolph systems for post-saw film-frame inspection looking for package defects.”A combination of Rudolph’s 2D/3D inspection systems and metal metrology systems provide a total process control solution to help assure that height, diameter, location and coplanarity of copper micro-bumps, pillar bumps, and TSVs are precisely controlled. After the packages are molded and separated by sawing, additional Rudolph inspection systems provide outgoing quality checks for sidewall delamination and/or hairline cracks, which are considered killer defects for advanced memory packages.About Rudolph TechnologiesRudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, lithography, process control metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide. Rudolph delivers comprehensive solutions throughout the fab with its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market of their devices. Headquartered in Wilmington, Massachusetts, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at http://www.rudolphtech.com.(NOTE: The above press release is from Rudolph Technologies via BusinessWire.)Like Wilmington Apple on Facebook. Follow Wilmington Apple on Twitter. Follow Wilmington Apple on Instagram. Subscribe to Wilmington Apple’s daily email newsletter HERE. Got a comment, question, photo, press release, or news tip? Email email@example.com.Share this:TwitterFacebookLike this:Like Loading… RelatedWilmington’s Rudolph Technologies Receives $8M Order From Leading Asian Memory ManufacturerIn “Business”Wilmington’s Rudolph Technologies Unveils New Inspection Suite For Semiconductor ManufacturingIn “Business”Wilmington’s Rudolph Technologies Receives $11 Million OrderIn “Business” read more
×Actors Reveal Their Favorite Disney PrincessesSeveral actors, like Daisy Ridley, Awkwafina, Jeff Goldblum and Gina Rodriguez, reveal their favorite Disney princesses. Rapunzel, Mulan, Ariel,Tiana, Sleeping Beauty and Jasmine all got some love from the Disney stars.More VideosVolume 0%Press shift question mark to access a list of keyboard shortcutsKeyboard Shortcutsplay/pauseincrease volumedecrease volumeseek forwardsseek backwardstoggle captionstoggle fullscreenmute/unmuteseek to %SPACE↑↓→←cfm0-9Next UpJennifer Lopez Shares How She Became a Mogul04:350.5x1x1.25×1.5x2xLive00:0002:1502:15 Reddit has raised a new $300 million round of funding from investors including Tencent, Sequoia, Fidelity and Andreessen Horowitz among others. The new round of funding values the company $3 billion, the company announced Monday morning, and brings the total amount raised to around $550 million.News of the funding was first reported by Techcrunch earlier this month. CNBC followed up Monday morning with an interview with Reddit’s CEO Steve Huffman, who told the publication that his company was continuing to build out its ads business. Huffman said that Reddit was also trying to become “a friendly home for users and brands alike,” which involved stepping up its fight against abuse on its platform.Reddit has been on a roll lately, growing its audience to 330 million monthly active users generating 14 billion page views in 2018. The company has also been doubling down on video last year, clocking some 1.4 billion video views a month at the end of last year. Reddit only introduced native video hosting in August of 2017. Popular on Variety Reddit was founded in 2005, and acquired by Condé Nast Publications in 2006. The site spun out of Condé Nast in 2011. The magazine publisher’s corporate owner Advance Publications, Inc. still holds a substantial stake in the company, but the newest round is said to have diluted that stake.Tencent’s leading role in the round led to some backlash among Reddit’s audience in recent days, with some users concerned that the influx of Chinese money was incompatible with Reddit’s commitment to free speech.Reddit is currently unavailable in China, as are some of Tencent’s other Western media investments: The company’s investment arm holds a significant stake in Snapchat’s corporate parent Snap, and owns around 40% of Epic Games. It’s also a business partner of Spotify after a stock swap with the music service in late 2017. read more