zoomImage Courtesy: Kongsberg Norwegian companies Wilhelmsen and Kongsberg are joining forces to establish the world’s first autonomous shipping company.The new joint venture company, named Massterly, will be based in Lysaker, Norway, and be fully operational from August 2018.Through the new company, the duo intends to offer “a complete value chain for autonomous ships, from design and development, to control systems, logistics services and vessel operations.”As explained, land-based control centers will be established to monitor and operate autonomous ships in Norway and internationally.“Autonomy and remote operations are an important development for the maritime industry and Norway’s lead has been made possible as a result of close cooperation between the Norwegian maritime cluster and the Norwegian authorities. In recent years there has been rapid development driven by a significant increase in demand… When autonomous ships soon are a reality, Massterly will be crucial for digitalising the infrastructure and operations,” Geir Håøy, President and CEO of Kongsberg, said.In 2017, Kongsberg and its compatriot fertilizer producer Yara teamed up on a project to build the world’s first autonomous and zero emissions ship, Yara Birkeland, by 2020. The vessel will be sailing between Yara’s Norwegian production facilities at Herøya and the ports of Brevik and Larvik. Massterly will be able to deliver and operate autonomous vessels such as Yara Birkeland, according to Kongsberg.“Currently, we are at the very beginning of this development, but we see and believe that there will be a significant market for these types of services in the near future. At first, short sea shipping will use autonomous ships. This also implies increased competitiveness to move transport from road to sea. The gains are increased efficiency and reduction of emissions. For Norway as a maritime nation, this will be an important contribution to reach the UN sustainable development goals,” Thomas Wilhelmsen, Wilhelmsen Group CEO, pointed out.Norway currently has three autonomous shipping test beds. The third test area was opened in Horten on the Oslofjord in December 2017.
WILMINGTON, MA — Rudolph Technologies, Inc. recently announced that it has received orders for over $15 million of legacy and new process control systems from a memory manufacturer based in Asia. The systems will be used by a top-tier memory chip maker as they rapidly transition high-end DRAM (DDR4, DDR5) and HBM DRAM packaging from wire bonding to advanced packaging architectures. The shift from wire bonding is needed to achieve higher data speeds, superior power distribution and thermal properties using copper pillars, micro-bumps, and through silicon vias (TSVs) for stacked chip-to-chip interconnects.Delivery of systems will be completed by the end of the first quarter, with additional orders expected throughout 2019 as memory manufacturers transition their high-speed DRAM from wire-bonded architecture to advanced packaging.“Rudolph began working with our customers’ R&D teams nearly ten years ago to develop 2D/3D measurements of the emerging copper bump process. That long-term customer engagement has resulted in systems and software that we believe to be the industry standard for advanced packaging metrology,” stated Cleon Chan, vice president of global field operations at Rudolph. “Stacking die using TSVs and micro-bumps for HBM DRAM packages requires precise control of the copper features that will ultimately make the electrical connections between the stacked memory chips and the logic chip in the same package. After significant development in the package and the process control methods, these devices are now beginning high-volume manufacturing, which is being driven by the data speed and capacity demands from big data servers and graphics applications. These new, non-wire bonded memory architectures are creating a very healthy demand for our back-end process control systems. This customer is also using Rudolph systems for post-saw film-frame inspection looking for package defects.”A combination of Rudolph’s 2D/3D inspection systems and metal metrology systems provide a total process control solution to help assure that height, diameter, location and coplanarity of copper micro-bumps, pillar bumps, and TSVs are precisely controlled. After the packages are molded and separated by sawing, additional Rudolph inspection systems provide outgoing quality checks for sidewall delamination and/or hairline cracks, which are considered killer defects for advanced memory packages.About Rudolph TechnologiesRudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, lithography, process control metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide. Rudolph delivers comprehensive solutions throughout the fab with its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market of their devices. Headquartered in Wilmington, Massachusetts, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at http://www.rudolphtech.com.(NOTE: The above press release is from Rudolph Technologies via BusinessWire.)Like Wilmington Apple on Facebook. Follow Wilmington Apple on Twitter. Follow Wilmington Apple on Instagram. Subscribe to Wilmington Apple’s daily email newsletter HERE. Got a comment, question, photo, press release, or news tip? Email email@example.com.Share this:TwitterFacebookLike this:Like Loading… RelatedWilmington’s Rudolph Technologies Receives $8M Order From Leading Asian Memory ManufacturerIn “Business”Wilmington’s Rudolph Technologies Unveils New Inspection Suite For Semiconductor ManufacturingIn “Business”Wilmington’s Rudolph Technologies Receives $11 Million OrderIn “Business” read more
A Bangladeshi peacekeeper receiving UN medal at MINUSMA’s operational base in Bamako, Mali. Photo: UNBThe UN has recently awarded 139 Bangladeshis serving with the United Nations Multidimensional Integrated Stabilisation Mission in Mali (MINUSMA), the UN medal for their efforts to support peace in the West African country.The medalists are members of a Bangladeshi Formed Police Unit (FPU), reports UNB.The medal ceremony was held at MINUSMA’s operational base in Bamako, Mali recently, said a press release on Saturday.The UN secretary-general’s deputy special representative Koen Davidse, MINUSMA police component deputy chief brigadier general Jean-Frederic Sellier, and many other guests, including a high-level delegation from Bangladesh, attended the colourful ceremony.Brigadier general Sellier said, “The decorated Bangladeshi police officers have performed their missions properly and with determination and professionalism. On behalf of MINUSMA, I congratulate you and thank you for the work accomplished.”The peacekeepers are from the fourth rotation of the Bangladeshi FPU, since the UN peacekeeping mission deployed in 2013.Bangladesh is the second largest contributor of military and police personnel to United Nations peacekeeping, with more than 7,000 currently serving around the world. Of them, more than 1,600 have been serving in Mali. read more